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Technical Briefs

Laser Cutting of Small Diameter Holes Into Alumina Tiles: Thermal Stress Analysis

[+] Author and Article Information
B. S. Yilbas, S. S. Akhtar

Department of ME, King Fahd University of Petroleum and Minerals, Dhahran, Saudi Arabia

C. Karatas

Engineering College, Hacettepe University, Ankara 06230, Turkey

J. Manuf. Sci. Eng 133(2), 024503 (Mar 23, 2011) (5 pages) doi:10.1115/1.4003737 History: Received May 13, 2010; Revised February 25, 2011; Published March 23, 2011; Online March 23, 2011

Laser cutting of small diameter holes in alumina tiles is carried out. Temperature and stress fields are predicted numerically using the ABAQUS finite element code. The cut sections are examined by incorporating scanning electron microscope and optical microscope. The residual stress developed in the cutting section is determined using the X-ray diffraction technique. It is found that high residual stresses are formed in the cutting section, and predictions agree well with the experimental results. The laser cut edges are found to be free from the large cracks. However, interconnected shallow cracks are observed at the hole cut surface.

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Copyright © 2011 by American Society of Mechanical Engineers
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Figures

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Figure 5

SEM micrograph of the laser cut surface

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Figure 6

XRD diffractogram for laser cut surfaces and as received workpiece

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Figure 4

von Mises stress distribution along the circumference of hole cut during heating cycle: (a) top surface of the kerf edge and (b) bottom surface of the kerf edge

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Figure 3

Temperature distribution along the circumference of hole cut during heating cycle: (a) top surface of the kerf edge and (b) bottom surface of the kerf edge

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Figure 2

Temporal variation of temperature predicted and obtained from thermocouples at two different locations 0.5 mm away from the cut edge

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Figure 1

Schematic view of laser cutting and the coordinate system

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