Technical Briefs

Modeling of Thermoelastic Stress Wave in Laser-Assisted Cell Direct Writing

[+] Author and Article Information
Wei Wang, Yafu Lin

Department of Mechanical Engineering, Clemson University, Clemson, SC 29634

Yong Huang1

Department of Mechanical Engineering, Clemson University, Clemson, SC 29634yongh@clemson.edu


Corresponding author.

J. Manuf. Sci. Eng 133(2), 024502 (Mar 14, 2011) (6 pages) doi:10.1115/1.4003612 History: Received August 26, 2009; Revised January 28, 2011; Published March 14, 2011; Online March 14, 2011

Laser-assisted cell direct-write technique has been a promising biomaterial direct-write method. For safe and reproducible cell direct writing, cell injury due to process-induced external stress must be understood in addition to biological property research. The objective of this study is to model the thermoelastic stress wave propagation inside the coating in laser-assisted cell direct writing when vaporization and/or optical breakdown of coating materials is/are not available. It is found that a bipolar pressure pair, with peak magnitudes on the order of 1 MPa or higher, has been developed within a finite thin coating medium. Shorter duration laser pulses lead to higher thermoelastic stresses. This study will help to understand the photomechanical stress and its relevance with biomaterial damage in laser-assisted cell direct writing.

Copyright © 2011 by American Society of Mechanical Engineers
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Figure 1

Schematic of laser-assisted cell direct writing

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Figure 2

Schematic of the computational domain

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Figure 3

Numerical and analytical solutions of the pressure history at a fixed location 100 μm below the laser spot center along the axisymmetric axis (delta pulse with a=200 μm)

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Figure 4

A representative pressure profile below the laser spot center (z=50 μm)

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Figure 5

Pressure distributions: (a) 3D pressure profile at 20 ns, (b) 2D pressure profile at 20 ns, (c) 3D pressure profile at 40 ns, and (d) 2D pressure profile at 40 ns

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Figure 6

Pressure profiles at z=50 μm along the axisymmetric axis under different laser pulse durations



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