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Research Papers

Thermocouple Fixation Method for Grinding Temperature Measurement

[+] Author and Article Information
Bin Shen, Albert J. Shih

Department of Mechanical Engineering, University of Michigan, Ann Arbor, MI 48109

Guoxian Xiao

Manufacturing Systems Research Laboratory, General Motors R&D, Warren, MI 48092

Changsheng Guo

 United Technologies Research Center, East Hartford, CT 06108

Stephen Malkin

Department of Mechanical and Industrial Engineering, University of Massachusetts, Amherst, MA 01003

J. Manuf. Sci. Eng 130(5), 051014 (Sep 11, 2008) (8 pages) doi:10.1115/1.2976142 History: Received September 22, 2007; Revised June 10, 2008; Published September 11, 2008

A new thermocouple fixation method for grinding temperature measurement is presented. Unlike the conventional method using a welded thermocouple, this new method uses epoxy for affixing the embedded thermocouple within a blind hole in the workpiece subsurface. During grinding, the thermocouple junction is exposed and bonded to provide direct contact with the ground surface by the smearing of the workpiece material. Experiments were conducted to evaluate this simplified thermocouple fixation method including the effect of thermocouple junction size. Heat transfer models were applied to calculate the energy partition for grinding under dry, wet, and minimum quantity lubrication (MQL) conditions. For shallow-cut grinding of cast iron using a vitreous bond aluminum oxide wheel, the energy partition using a small wheel depth of cut of 10μm was estimated as 84% for dry grinding, 84% for MQL grinding, but only 24% for wet grinding. Such a small energy partition with wet grinding can be attributed to cooling by the fluid at the grinding zone. Increasing the wheel depth of cut to 25μm for wet grinding resulted in a much bigger energy partition of 92%, which can be attributed to fluid film boiling and loss of cooling at the grinding zone.

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Copyright © 2008 by American Society of Mechanical Engineers
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Figures

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Figure 1

Experimental setup: (a) overview of the setup, (b) MQL fluid delivery device, and (c) schematic drawing of grinding temperature measurement

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Figure 2

Cross-section view of blind hole tips: (a) EDM drilled using a tubular electrode and (b) EDM modified using a solid electrode

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Figure 3

Illustration of thermocouple fixation: (a) cross-section view and (b) schematic drawing

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Figure 4

Illustration of thermocouple fixation: (a) closely matched thermocouple tip and hole with good connection and (b) large hole leading to a gap surrounding the thermocouple tip

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Figure 5

Difference between (a) welded thermocouple and (b) epoxied thermocouple

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Figure 6

Peak temperature rise versus grinding passes for epoxied thermocouple method

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Figure 7

Temperature rise at different depths in dry grinding: Exp. W with welded thermocouple (30 gauges), Exps. E1, E2, and E3 with epoxied thermocouple (30 gauges), and Exps. ES1 and ES2 with epoxied thermocouple (46 gauges)

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Figure 8

Measured grinding temperature at the workpiece surface at depth z=0 (dry condition)

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Figure 9

Temperature rise in wet grinding at different grinding conditions: (a) depth of cut a=10 μm and workpiece velocity vw=2.4 m/min and (b) a=25 μm and vw=3 m/min

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Figure 10

Temperature rise at different depths in MQL grinding (grinding fluid flow rate=15 ml/min)

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Figure 11

Schematic drawing of heat transfer in down grinding

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Figure 12

Experimental and theoretical maximum temperature rise versus the depth z

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