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Technical Briefs

Modeling of Material Removal Rate in Micro-ECG Process

[+] Author and Article Information
Kishore S. Gaikwad

Department of Mechanical Engineering, Indian Institute of Technology, Bombay, Mumbai 400076, India

Suhas S. Joshi1

Department of Mechanical Engineering, Indian Institute of Technology, Bombay, Mumbai 400076, Indiassjoshi@iitb.ac.in

1

Corresponding author.

J. Manuf. Sci. Eng 130(3), 034502 (May 06, 2008) (7 pages) doi:10.1115/1.2844587 History: Received April 09, 2006; Revised January 10, 2008; Published May 06, 2008

Microelectrochemical grinding (micro-ECG) is a variant of electrochemical grinding (ECG) process, in which material is removed by a combination of electrolytic dissolution and abrasive action that take place in a small interelectrode gap. This paper discusses analytical modeling of the material removal phenomenon in micro-ECG process to predict material removal rate. In the model, the phenomena, which contribute to the material removal in the process by electrolytic and abrasive actions, have been considered; these include streaming potential in the electrochemical action and shearing forces due to the flow of electrolyte through interelectrode gap and the abrasive action of grinding wheel. Two configurations of the process, viz., surface and cylindrical micro-ECG, have been modeled. The results have been validated by CFD simulation in the case of surface micro-ECG process, and specific experimentation in the case of cylindrical micro-ECG process.

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Copyright © 2008 by American Society of Mechanical Engineers
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Figures

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Figure 1

(a) Schematic of micro-ECG showing hydroxide layer and forces and (b) schematic of surface micro-ECG

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Figure 2

Schematic of flow of electrolyte-gas mixture in cylindrical micro-ECG

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Figure 3

Probabilistic distribution of abrasive grains over grinding wheel surface (17)

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Figure 4

Evaluation of MRRECM and MRRabrasion by analytical method for 0.3mm wide grinding wheel

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Figure 5

(a) Percentage contribution of MRRECM by analytical method and (b) percentage contribution of MRRabrasion by analytical method

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Figure 6

CFD simulation results showing pressure drop at various cross sections in the interelectrode gap of 5μm and the corresponding boundary conditions

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Figure 7

Resultant force in the interelectrode gap in surface micro-ECG

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Figure 8

Comparison of MRRabrasion from simulation and analytical model

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Figure 9

Experimental setup of micro-ECG and machined components: (a) overall setup, (b) machining in progress, (c) microslot at a voltage 7V, flow rate of 2000mm3∕s, and wheel speed of 194rpm, and (d) microslot at a voltage of 7V, flow rate 2500mm3∕s, and wheel speed and 374rpm

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Figure 10

Comparison of MRRtotal values evaluated from the experiments and the analytical model

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