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Technical Briefs

Enhanced Laser Shock by an Active Liquid Confinement—Hydrogen Peroxide

[+] Author and Article Information
Yiliang Liao, Yingling Yang

School of Industrial Engineering,  Purdue University, West Lafayette, IN 47906

Gary J. Cheng1

School of Industrial Engineering,  Purdue University, West Lafayette, IN 47906gjcheng@purdue.edu

1

Corresponding author.

J. Manuf. Sci. Eng 134(3), 034503 (May 07, 2012) (4 pages) doi:10.1115/1.4006552 History: Received May 02, 2011; Revised February 07, 2012; Published May 04, 2012; Online May 07, 2012

This letter investigates a unique process to generate enhanced laser shock by applying an active liquid confinement—hydrogen peroxide (H2 O2 ). The mechanism of fast chemical etching-assisted laser ablation is proposed. As a result, comparing with utilizing water as confinement, the efficiency of laser shock peening (LSP) of aluminum alloy 6061 with an active liquid confinement is improved by 150%, and the ablation rate of pulse laser ablation (PLA) of zinc is enhanced by 300%. This method breaks the major limitation of underwater pulsed laser processing caused by the breakdown plasma, with additional mechanisms to generate higher ablation rate and shock pressure under the same laser intensities.

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Copyright © 2012 by American Society of Mechanical Engineers
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Figures

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Figure 1

The comparison of surface hardness (VHN) and plastic deformation depth of AA6061 after LSP in H2 O2 and water

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Figure 2

The schematic illustration of fast chemical etching-assisted pulsed laser ablation. (a) Ionization and (b) plasma etching.

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Figure 3

Mechanism of fast chemical etching-assisted pulsed laser ablation

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Figure 4

Ablation depth and volume of PLA of zinc with H2 O2 and H2 O confinements

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