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SPECIAL ISSUE ON NANOMANUFACTURING

Comparison of Nickel Nanoparticle-Assisted Diffusion Brazing of Stainless Steel to Conventional Diffusion Brazing and Bonding Processes

[+] Author and Article Information
S. K. Tiwari

School of Mechanical, Industrial, and Manufacturing Engineering, Oregon State University, Corvallis, OR 97331santos.tiwari@gmail.com

B. K. Paul

School of Mechanical, Industrial, and Manufacturing Engineering, Oregon State University, Corvallis, OR 97331

J. Manuf. Sci. Eng 132(3), 030902 (May 13, 2010) (5 pages) doi:10.1115/1.4001554 History: Received June 15, 2009; Revised April 04, 2010; Published May 13, 2010; Online May 13, 2010

Transient liquid phase diffusion brazing is used in precision, hermetic joining applications as a replacement for diffusion bonding to reduce cycle times, reduce bonding pressure, and improve yields. In the present study, stainless steel 316L laminae are diffusion brazed with an interlayer of nickel nanoparticles and compared with samples joined by conventional diffusion bonding and electroplated nickel-phosphorous diffusion brazing. Comparison is made with regard to microstructural evolution, diffusional profile, and bond strength. All bonding was carried out in a uni-axial vacuum hot press at 1000°C with a heating rate of 10°C/min, a dwell time of 2 h and a bonding pressure of 10 MPa. Bond strength measurements show that the sample brazed with a nickel nanoparticle interlayer has the lowest void fraction at 4.8±0.9% and highest shear strength at 141.3±7.0MPa. Wavelength dispersive spectroscopic analysis of sample cross-sections shows substantial diffusion of Ni and Fe across the nickel nanoparticle bond line. Scanning electron micrographs show no secondary phases along the nickel nanoparticle bond line.

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Copyright © 2010 by American Society of Mechanical Engineers
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Figures

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Figure 1

(a) Sample type A and (b) sample type b with graphite fixtures

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Figure 2

SEM images of the nickel nanoparticles film on SS substrate at (a) low and (b) high magnifications

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Figure 3

SEM images of bond line for etched samples (a) diffusion bonded (b) NiP, brazed and (c) NiNP brazed (26)

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Figure 4

Comparison of different element concentration in diffusion bonded, NiP brazed and NiNP brazed samples

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Figure 5

Void fractions of diffusion bonded, NiP brazed, and NiNP brazed samples

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Figure 6

Comparison of shear stress of diffusion bonded, NiP brazed, and NiNP brazed samples

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Figure 7

Fractography of (a) diffusion bonded, (b) NiP brazed, and (c) NiNP brazed samples

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