Multiscale Finite Element Modeling of Silicon Nitride Ceramics Undergoing Laser-Assisted Machining

[+] Author and Article Information
Yinggang Tian

School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907

Yung C. Shin

School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907shin@ecn.purdue.edu

J. Manuf. Sci. Eng 129(2), 287-295 (Oct 26, 2006) (9 pages) doi:10.1115/1.2673595 History: Received April 25, 2006; Revised October 26, 2006

A multiscale finite element model is developed to simulate the chip formation in laser-assisted machining of silicon nitride ceramics. To consider the workpiece heterogeneous microstructure and crack evolution in silicon nitride machining, the workpiece material is modeled with continuum elements imbedded in thin interfacial cohesive elements. The continuum elements simulate the deformation of the bulk workpiece while the interfacial cohesive elements account for the initiation and propagation of intergranular cracks. The model reveals that discontinuous chips form by the propagation of cracks in the shear zone while the machined surface is generated by plastic deformation of the workpiece material under confined high pressure. The simulated cutting forces, chip morphology and subsurface integrity are compared with corresponding experimental observations and the validity of the present model is shown by the good agreements in the comparisons.

Copyright © 2007 by American Society of Mechanical Engineers
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Figure 1

Microstructure of silicon nitride ceramics

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Figure 2

Illustration of the multiscale finite element modeling of silicon nitride

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Figure 3

Sketch of an irreversible cohesive model

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Figure 4

Soft contact pressure–overclosure relationship

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Figure 5

Sketches of the 3D nose turning and simplified cutting: (a) 3D nose turning; and (b) simplified cutting

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Figure 6

Simulated chip formation and Mises stress distributions for the case of LAM1

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Figure 7

Simulated the main cutting and thrust forces for the case of LAM1

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Figure 8

Simulated formation of the second chip for the case of LAM1

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Figure 9

Comparison of the average values of the simulated and measured forces

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Figure 10

SEM micrograph of the silicon nitride chip generated in the case of LAM1

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Figure 11

SEM section view of a silicon nitride part produced by LAM

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Figure 12

Simulated residual stress variations with the depth from the machined surface



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