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DESIGN INNOVATION

Development of a Device for Measuring the Transverse Motion of a Saw-Wire

[+] Author and Article Information
Masahiro Mizuno

Department of Mechanical Engineering, Iwate University, 4-3-5 Ueda, Morioka, 020-8551, Japanm.mizuno@iwate-u.ac.jp

Toshirou Iyama, Shinya Kikuchi

Department of Mechanical Engineering, Iwate University, 4-3-5 Ueda, Morioka, 020-8551, Japan

B. Zhang

Department of Mechanical Engineering, University of Connecticut, 191 Auditorium Road, U-139, Storrs, CT 06269-3139

J. Manuf. Sci. Eng 128(3), 826-834 (Jan 24, 2006) (9 pages) doi:10.1115/1.2194060 History: Received April 27, 2005; Revised January 24, 2006

The transverse motion of a saw-wire affects the cutting surface geometry in wire-saw slicing. To evaluate the magnitude of the wire transverse motion under no-slurry and no-workpiece conditions, which should be minimized before starting the slicing process, a high accuracy, noncontact device has been developed. The measuring head of the device is composed of a laser diode module and a dual-element photodiode between which a saw-wire is placed for measurement. This paper elucidates the appropriate positional configurations of the photosensitive surface of the dual-element photodiode and the laser beam focal point with respect to the 160μm diameter wire in the laser beam direction. Furthermore, a measurement experiment is carried out on a wire-saw machine under no-slurry and no-workpiece conditions. The paper reports and discusses the critical issues, such as measurement sensitivity, linearity, and accuracy.

Copyright © 2006 by American Society of Mechanical Engineers
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Figures

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Figure 1

Effect of the transverse displacement of the saw-wire on the cutting surface geometry: (a) curvature in the slicing direction caused by the very slow non-oscillation transverse displacement; (b) edge rounding caused by the transverse oscillation

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Figure 2

Measurement principle: a laser beam, projected to a dual-element photodiode, is partially blocked by the saw-wire being measured

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Figure 3

Outline of the measuring device

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Figure 4

Dimensions of the DEPD

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Figure 5

Three configurations of the wire, the DEPD and the laser beam focal point: (a) WPF; (b) FWP; (c) WFP

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Figure 6

Experimental method for detecting the position of the focal point of the laser beam

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Figure 7

Relationship between the reading of micrometer head Z and the value SLD

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Figure 8

Method for determining the laser beam width in the y direction

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Figure 9

Laser beam width in the y direction

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Figure 10

Distance between the wire being measured and the wire adjacent to it

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Figure 11

Experimental apparatus for finding the optimum positional configuration of the wire, the DEPD and the laser beam focal point

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Figure 12

Example measurement results obtained for the FWP configuration when the wire center is at z=1mm and the distance between the wire center and the photosensitive surface of the DEPD is 6mm

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Figure 13

Effect of the positional configuration defined in Fig. 5 on the measurement sensitivity Sw: (a) WPF; (b) FWP; (c) WFP

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Figure 14

Effect of the positional configuration defined in Fig. 5 on the nonlinearity: (a) WPF; (b) FWP; (c) WFP

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Figure 15

Effect of the positional configuration defined in Fig. 5 on the transverse sensitivity ratio: (a) WPF; (b) FWP; (c) WFP

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Figure 16

Measurement on a wire-saw machine

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Figure 17

Once-per-roller-revolution oscillation of the saw-wire: (a) wire speed=20m∕min; (b) wire speed=300m∕min; (c) wire speed=600m∕min

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Figure 18

Results of FFT analysis of the waveforms in Fig. 1: (a) wire speed=20m∕min; (b) wire speed=300m∕min; (c) wire speed=600m∕min

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Figure 19

Analysis of the noise obtained while running the saw-wire at 600m∕min but not running the saw-wire between the LD module and the DEPD: (a) differential output obtained without the wire between the LD module and the DEPD; (b) a result of a FFT analysis of the waveform in (a)

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