Deposition Technologies For Micromanufacturing: A Review

[+] Author and Article Information
Vinay Kadekar, Weiya Fang, Frank Liou

University of Missouri-Rolla, Rolla, MO 65409-1350

J. Manuf. Sci. Eng 126(4), 787-795 (Feb 04, 2005) (9 pages) doi:10.1115/1.1811118 History: Received February 04, 2004; Revised August 17, 2004; Online February 04, 2005
Copyright © 2004 by ASME
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Plot of mass flow rate versus frequency for flow through 0.5 mm nozzle 11
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(a) Laser-guided direct-write system and (b) flow-guided direct-write system 31
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Schematic diagram of LCVD upper reaction chamber 17
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Relationship between powder flow rate W and frequency f8
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Relationship between powder flow rate W and frequency f with different capillary diameter d for ash and alumina. Dp50 is mass median diameter of primary particle, and a is amplitude of vibration 8
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Origin of backward restoring force F for sphere located below tweezers’ focus 36
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Typical setup for electrodeposition with both the electrodes dipped in an electrolyte solution
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LCVD process showing the growth of Si using a single laser 37
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Boron microsprings made by LCVD 44
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Platinum lines of 2 μm wide and separated by 5 μm are deposited on alumina substrate 31
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Experimental layout of LIFT 25
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Au line 10 μm thick deposited on RO4003 substrate using LIFT 47
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Laser-based micro-SDM system with ultrasonic micropowder feeder 24
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Stainless-steel powders deposited on a silicon substrate with 280 V input voltage and a velocity of 4 mm/s 24
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Typical localized electrochemical deposition process 50
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Nickel structure deposited by spiraling an uninsulated Pt electrode in a Ni(SO3NH2)2 solution 50
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Schematic diagrams showing the EFAB process. (a) the anode and the cathode are brought in contact in the presence of an electrolyte; (b) the first deposited layer; (c) final deposited part along with the filler material 31
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A 24-layered nickel structure built using the EFAB process 28




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