0
TECHNICAL PAPERS

Deposition Technologies For Micromanufacturing: A Review

[+] Author and Article Information
Vinay Kadekar, Weiya Fang, Frank Liou

University of Missouri-Rolla, Rolla, MO 65409-1350

J. Manuf. Sci. Eng 126(4), 787-795 (Feb 04, 2005) (9 pages) doi:10.1115/1.1811118 History: Received February 04, 2004; Revised August 17, 2004; Online February 04, 2005
Copyright © 2004 by ASME
Your Session has timed out. Please sign back in to continue.

References

Lang,  J., Stewart,  J. G., and Liou,  F. W., 2000, “Laser Metal Forming Processes for Rapid Prototyping,” Int. J. Prod. Res., 38, pp. 3973–3996.
Schlienger, E., Dimos, D., Griffith, J., Michael, J., Oliver, M., Romero, T., Smugeresky, J., 1998, “Near Net Shape Production of Metal Components Using LENS® ,” Proc. Third Pacific Rim International Conference on Advanced Material and Processing, Honolulu, HI, p. 1581.
Griffith, M. L., Harwell, L. D., Romero, J. A., Schlienger, E., Atwood, C. L., Smugeresky, J. E., 1997, “Multi-Material Processing by LENS® ,” Proc. Solid Freeform Fabrication Symposium, Austin, TX, p. 387.
Xu,  J. T. , 2002, “Laser Guidance Deposition Technique for Patterning Microstructures Made of Nanoparticles With Varing Surface Functionality,” Mater. Res. Soc. Symp. Proc., 728.
Castelino, K., and Satyanaraya, S., “Fabrication of Two and Three-Dimensional Microstructures Using Optical Tweezers and Chemical Assembly,” report, UC-Berkeley, CA, from http://kingkong.me.berkeley.edu/∼kenneth/.
Lackey, J. et al., 2002, “Laser CVD System Design, Operation, and Modeling,” Manufacturing and Industrial Innovation Research Conf., San Juan.
Ehrlich, D. J., and Tsao, J. Y., 1989, Laser Microfabrication-Thin Film Processes and Lithography, Academic Press, New York.
Matsusaka,  S., Yamamoto,  K., and Masuda,  H., 1995, “Micro-Feeding of a Fine Powder Using a Vibration Capillary Tube,” Adv. Powder Technol.,7, pp. 141–151.
Matsusaka,  S., Yamamoto,  K., and Masuda,  H., 1995, “Micro-Feeding of Fine Powders Using a Capillary Tube With Ultrasonic Vibration,” Adv. Powder Technol.,6, pp. 283–293.
Seno,  H., and Kondo,  T., 1989, “Development of the Micro-Feeder for Fine Particles,” J. Soc. Powder Technol. Japane,26, pp. 340–344.
Kumar,  P., Santosa,  J. K., Beck,  E., and Das,  S., 2003, “Direct-Write Deposition of Fine Powders Through Miniature Hopper-Nozzles for Multi-Materials Solid Freeform Fabrication,” Rapid Prototyping J., (in press).
Li, X. C., Choi, H., and Yang, Y., 2002, “Laser-Based Meso/Micro Rapid Manufacturing System,” Solid Freeform Fabrication Proc., Univ. of Texas, Austin, TX.
Miller, D., Renn, M., King, B., and Essien, M., “Maskless Mesoscale Materials Deposition,” from http://www.optomec.com/downloads/HDI,%20September%202001.pdf
Chen, J., Chen, T., Liu, S. B., and Zhou, T. C., 2003, “The Investigation on Laser Microfabrication With Metallic Powder,” 22nd ICALEO, Florida.
Castelino, K., Satyanaraya, S., and Sitti, M., “Manufacturing of Two and Three-Dimensional Microstructures by Integrating Optical Tweezers With Chemical Assembly,” Report, UC-Berkeley, CA.
Wallenberger,  F. T., 1995, “Rapid Prototyping Directly From Vapor Phase,” Science, 267, pp. 1274–1275.
Jeong, S. et al., 2002, “Laser-Assisted Chemical Vapor Deposition of Carbon for the Growth of High Aspect Ratio Micro Rods and Direct Writing of Surface Pattern,” LAMP, 3rd LPM, Osaka, Japan.
Jeong, S., Han, S., and Selvan, J. S., 2003, “Fabrication of Three Dimensional Microstructures by Stacking Laser-Direct-Write Layers,” International Congress on LMP, pp. 21–24.
El-Giar,  E. M. , 2000, “Localized Electrochemical Deposition of Copper Microstructures,” J. Electrochem. Soc., 147(2), pp. 586–591.
Said, R. A., 2001, “Controlling Shape Formation of Copper Microstructures Fabricated by Localized Electrochemical Deposition,” 200th Meeting of The ECS and 52nd Meeting of The ISE, San Francisco.
Pan,  L. W., Yuen,  P., and Lin,  L., 2002, “3D Electroplated Microstructures Fabricated by a Novel Height Control Method,” Microsys. Technol.,8, pp. 391–394.
Said, R. A., 2001, “Tip Geometry Artifacts on the Shape of Copper Microstructures Fabricated by Localized Electrochemical Deposition,” 200th Meeting of The ECS and 52nd Meeting of The ISE, San Francisco.
Brunger,  W. H., and Kohlmann,  K. T., 1993, “E-Beam-Induced Fabrication of Microstructures,” J. Microelectrochem. Systems,2, pp. 30–32.
Li, X. C., Choi, H., and Yang, Y., 2002, “Micro Rapid Prototyping of 3D Heterogeneous MEMS,” Int. Conf. on Metallurgical Coatings and Thin Films,” San Diego, 420–421 , pp. 515–523.
Bohandy,  J., Kim,  B. F., and Adrian,  F. J., 1986, “Metal Deposition From a Support Metal Film Using an Excimer Laser,” J. Appl. Phys., 60, pp. 1538–1539.
Zergioti,  I. , 1998, “Microdeposition of Metals by Femtosecond Eximer Laser,” Appl. Surf. Sci., 127–129, pp. 601–605.
Tan,  B., Venkatakrishnan,  K., and Tok,  K. G., 2003, “Selective Surface Texturing Using Femtosecond Pulsed Laser Induced Forward Transfer,” Appl. Surf. Sci., 207, pp. 365–371.
Microfabrica Inc, “Going Beyond Silicon MEMS With EFAB Technology,” retrieved January 15, 2004 from http://www.microfabrica.com/resource_center/EFAB_White_Paper_Microfabrica.pdf.
Linoya, L., Gotoh, K., and Higashitani, K., 1991, Powder Technology Handbook, Marcel Dekker, New York.
Saito,  M., Kimura,  O., and Yoda,  N., 1989, “A Quantitative Powder Supply Method Using Ultrasonic Vibration,” J. Acoust. Soc. Jpn., 45, pp. 38–43.
Pique, A., and Chrisey, D. B., 2001, Direct-Write Technologies for Rapid Prototyping Applications, Academic Press.
Ashkin,  A., 1997, “Optical Trapping and Manipulation of Neutral Particles Using Lasers,” Proc. Natl. Acad. Sci. U.S.A., 94, pp. 4853–4860.
Ashkin,  A., and Dziedzic,  J. M., 1987, “Optical Trapping and Manipulation of Viruses and Bacteria,” Science, 235, pp. 1517–1520.
Buican,  T. N. , 1987, “Automated Single-Cell Manipulation and Sorting by Light Trapping,” Appl. Opt., 26, pp. 5311–5316.
Ashkin,  A., 1992, “Forces of a Single-Beam Gradient Laser Trap on a Dielectric Sphere in the Ray Optics Regime,” Biophys. J., 61, 569–582.
Balykin,  V. I., and Jhe,  W., 2000, “Atom Optics,” J. Korean Phys. Soc., 37, pp. 654–660.
Mazumder, J., and Kar, A., 1993, Theory and Application of Laser Chemical Vapor Deposition, Plenum Press, New York.
Jean, D. J. et al., 1999, “Precision LCVD System Design With Real Time Process Control,” Tenth Annual Solid Freeform Fabrication Symp., pp. 59–65.
Nelson,  L. S., and Richardson,  N. L., 1972, “Formation of Thin Rods of Pyrolytic Carbon by Heating With a Focused Carbon Dioxide Laser,” Mater. Res. Bull., 7, pp. 971–976.
Bauerle, D., 1986, Chemical Processing with Lasers, Springer-Verlag, Berlin, 224 , pp. 71–93.
Gow,  T. R., Coronell,  D. G., and Masel,  R. I., 1989, “Mechanism of Laser-Assisted CVD of Germanium,” J. Mater. Res., 4, pp. 634–640.
Conde,  O., Kar,  A., and Mazumder,  J., 1992, “Laser Chemical Vapor Deposition of TiN Dots: A Comparison of Theoretical and Experimental Results,” J. Appl. Phys., 72(2), pp. 754–761.
Silvestre,  A. J., Santos,  M. J., and Conde,  O., 2002, “The Role of Carbon Precursor in Boron Carbide Synthesis by Laser-CVD,” Key Eng. Mater., 230–232, pp. 56–59.
Westberg, H., 1992, “Thermal Laser-Assisted Chemical Vapor Deposition,” Summary of Dissertations 375, Faculty of Science, University of Uppsala, Sweden.
Renn,  M. J., and Pastel,  R., 1998, “Particle Manipulation and Surface Patterning by Laser Guidance,” J. Vac. Sci. Technol., pp.3859–3863.
Renn,  M. J., Pastel,  R., and Lewandowski,  H., 1999, “Laser Guidance and Trapping of Mesoscale Particles in Hollow Optical Fibers,” Phys. Rev. Lett., 82, p. 1574.
Pique,  A. , 1999, “A Novel Laser Transfer Process for Direct Writing of Electronic and Sensor Materials,” Appl. Phys. A: Mater. Sci. Process., 699(supply), pp. 279–284.
Schneir,  J., Hansma,  P. K., Elings,  V., Gurley,  J., Wickramasinghe,  K., R.,  Sonnenfeld, 1988, “Creating and Observing Surface Features With a Scanning Tunneling Microscope,” Proc. SPIE, The International Society for Optical Engineering, 897, pp. 16–19.
Wuu,  Y. M., Fan,  F. R., and Bard,  A. J., 1989, “High Resolution Deposition of Polyaniline on pt With the Scanning Electrochemical Microscope,” J. Electrochem. Soc., 136, pp. 885–886.
Madden,  J., Hunter,  D., and Ian,  W., 1996, “Three-Dimensional Microfabrication by Localized Electrochemical Deposition,” J. Microelectromech. Syst., 5, pp. 24–32.
Bard, A. J., Husser, A. J., and Craston, D. H., 1990, “High Resolution Deposition and Etching in Polymer Films,” U.S. Patent 4968390.

Figures

Grahic Jump Location
Plot of mass flow rate versus frequency for flow through 0.5 mm nozzle 11
Grahic Jump Location
(a) Laser-guided direct-write system and (b) flow-guided direct-write system 31
Grahic Jump Location
Schematic diagram of LCVD upper reaction chamber 17
Grahic Jump Location
Relationship between powder flow rate W and frequency f8
Grahic Jump Location
Relationship between powder flow rate W and frequency f with different capillary diameter d for ash and alumina. Dp50 is mass median diameter of primary particle, and a is amplitude of vibration 8
Grahic Jump Location
Origin of backward restoring force F for sphere located below tweezers’ focus 36
Grahic Jump Location
Typical setup for electrodeposition with both the electrodes dipped in an electrolyte solution
Grahic Jump Location
LCVD process showing the growth of Si using a single laser 37
Grahic Jump Location
Boron microsprings made by LCVD 44
Grahic Jump Location
Platinum lines of 2 μm wide and separated by 5 μm are deposited on alumina substrate 31
Grahic Jump Location
Experimental layout of LIFT 25
Grahic Jump Location
Au line 10 μm thick deposited on RO4003 substrate using LIFT 47
Grahic Jump Location
Laser-based micro-SDM system with ultrasonic micropowder feeder 24
Grahic Jump Location
Stainless-steel powders deposited on a silicon substrate with 280 V input voltage and a velocity of 4 mm/s 24
Grahic Jump Location
Typical localized electrochemical deposition process 50
Grahic Jump Location
Nickel structure deposited by spiraling an uninsulated Pt electrode in a Ni(SO3NH2)2 solution 50
Grahic Jump Location
Schematic diagrams showing the EFAB process. (a) the anode and the cathode are brought in contact in the presence of an electrolyte; (b) the first deposited layer; (c) final deposited part along with the filler material 31
Grahic Jump Location
A 24-layered nickel structure built using the EFAB process 28

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In