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TECHNICAL PAPERS

Microforming: Experimental Investigation of the Extrusion Process for Micropins and its Numerical Simulation Using RKEM

[+] Author and Article Information
Jian Cao, Neil Krishnan, Zhong Wang, Hongsheng Lu, Wing K. Liu, Anthony Swanson

Department of Mechanical Engineering, Northwestern University, 2145 Sheridan Road, Evanston, IL 60208

J. Manuf. Sci. Eng 126(4), 642-652 (Feb 04, 2005) (11 pages) doi:10.1115/1.1813468 History: Received March 29, 2004; Revised August 02, 2004; Online February 04, 2005
Copyright © 2004 by ASME
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References

Figures

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(a) Deformed grains for the larger pin, initial grain size=87 μm; (b) deformed grains for the smaller pin, initial grain size=87 μm (scale bar=50 μm)
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Deformed grains for the larger pin, initial grain size=211 μm; deformed grains for the smaller pin, initial grain size=211 μm (scale bar=50 μm)
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True stress versus true strain (211 μm grain size)
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True stress versus true strain (all grain sizes)
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Segmented die used for extrusion of micropins
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Forming assembly and the tensile loading substage
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Force-displacement response for extrusion of 32 μm grain-size sample using smooth die
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Force-displacement response for extrusion of 87 μm grain-size sample using smooth die
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Force-displacement response for extrusion of 211 μm grain-size sample using smooth die
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Average and rms surface roughness after each test at the 1.5 mm region of the smooth die
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Average and rms surface roughness after each test at the 1.0 mm region of the smooth die
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Force-displacement response for extrusion of 32 μm grain-size sample using rough die
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Force-displacement response for extrusion of 87 μm grain-size sample using rough die
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Force-displacement response for extrusion of 211 μm grain-size sample using rough die
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Average and rms surface roughness after each test at the 1.5 mm region of the rough die
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Average and rms surface roughness after each test at the 1.0 mm region of the rough die
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Sample of the deformed pins
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3D hexahedral sub-domain element
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Subdivision and its center in the representative domain of node L
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Comparison of equivalent plastic strain using (a) ABAQUS Explicit and (b) the RKEM
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Comparison of the force-displacement response for ABAQUS Explicit, the RKEM, and experimental results
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The influence domains of nodes near the material interface
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(a) Discretization of material interface in 2-D (b) Shape function of node I (c) The x-derivative of shape function of node I on the side of material B (d) The x-derivative of shape function of node I on the side of material A
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Examples of various metallic microparts used in industry
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(a) Microstructure of brass sample after heat treatment at 610°C for 1 h, grain size=87 μm; (b) microstructure of brass sample after heat treatment at 700°C for 1 h, grain size=211 μm
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Schematic of extruded pin with dimensions for the two cases: larger pin and smaller pin
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Representative domain of node L
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Deformations of extrusion in 2D. The development of the hourglass mode can be clearly seen.

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