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TECHNICAL PAPERS

Generation of Defects Due to Machining of TiAl Intermetallic Compound and Their Effects on Mechanical Strength

[+] Author and Article Information
Toshiaki Furusawa, Hiroshi Hino, Sinji Tsuji, Sadatoshi Koroyasu

School of Science and Engineering, Teikyo University, Toyosatodai, 1-1, Utsunomiya city, Tochigi, Japan

Atsushi Ichikawa

Tochigi Factory, Honda Motor Co., Ltd., Matsuyama-cho, 19, Mohka city, Tochigi, Japan

J. Manuf. Sci. Eng 126(3), 506-514 (Sep 07, 2004) (9 pages) doi:10.1115/1.1751425 History: Received November 01, 2002; Revised October 01, 2003; Online September 07, 2004
Copyright © 2004 by ASME
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References

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Huang, S. C., and Chesnutt, J. C., 1995, Intermetallic Compounds. Principles and Practice, Vol. 2 Practice: Gamma TiAl and its Alloys, Westbrook, J. H., et al., eds., John Wiley and Sons, Chichester, UK, pp. 73–90.
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Figures

Grahic Jump Location
Observations of the main cracks after rupture of the specimens (a) R type:σB=493 MPa (b) R type:σB=757 MPa (c) P type:σB=416 MPa (d) P type:σB=729 MPa
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Weibull distributions of bending strength for chamfered specimens in different directions
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SEM images near main crack at edge after rupture of chamfered specimen
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SEM images of crack propagation after rupture of non-chamfered specimens (a) R type (b) P type
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Relationship between length of crack propagation and the bending strength for cutting specimens
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SEM image of crack propagation at higher magnification of Fig. 10(a)
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Weibull distributions of bending strength for grinding specimens in different directions and of those cut only and then chamfered after cutting (a) R type (b) P type
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Relationship between length of crack propagation and the bending strength for grinding specimens
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Weibull distribution of bending strength for polishing and grinding specimens
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SEM images of deformed layer for cutting, grinding and polishing (a) Cutting (b) Grinding (c) Polishing
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Schematic drawings of R and P type specimens (a) R type (b) P type
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Observation of chip when cutting the workpiece
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SEM image of defects formed on the machined surface
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SEM image of defects distributed on etched machined surface
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Schematic depiction of generating process of surface defects (a) Initiation of crack (b) Crack opening (c) Formation of tear
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SEM image of chippings formed along the edge
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Weibull distributions of bending strength for cutting specimens in different directions

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