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TECHNICAL PAPERS

Developments in Microelectromechanical Systems (MEMS): A Manufacturing Perspective

[+] Author and Article Information
Srinivas A. Tadigadapa

Department of Electrical Engineering, The Penn State University, University Park, PA 16802

Nader Najafi

Integrated Sensing Systems Inc., 387 Airport Industrial Drive, Ypsilanti, MI 48198

J. Manuf. Sci. Eng 125(4), 816-823 (Nov 11, 2003) (8 pages) doi:10.1115/1.1617286 History: Received February 01, 2002; Revised March 01, 2003; Online November 11, 2003
Copyright © 2003 by ASME
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References

Figures

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Size (Linear dimension) dependence of common forces and phenomena
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The top view of the ultra-sensitive, vacuum absolute pressure sensor
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Cost of production of MEMS chip as a function of the number of wafer and the number of chips per wafer. Further, the following assumptions have been made: Non-recurring Development Cost of $1 Million, and Production Cost/Wafer of $1000.
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Schematic diagram of Dissolved Wafer Process
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Calculated increase in cavity pressure as a function of time for a 4 mm×100 μm high hermetically sealed cavity
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Performance of the main and reference capacitors measured after 3.5 million cycles shows no detectable variations in the deflection sensitivity of the diaphragm
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Evaluation of protective coatings by measuring the etch (corrosion) depths in an accelerated gaseous environment
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Projected sales of MEMS devices by technology area. (Courtesy: System Planning Corporation Report 1999).

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