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TECHNICAL PAPERS

Developments in Microelectromechanical Systems (MEMS): A Manufacturing Perspective

[+] Author and Article Information
Srinivas A. Tadigadapa

Department of Electrical Engineering, The Penn State University, University Park, PA 16802

Nader Najafi

Integrated Sensing Systems Inc., 387 Airport Industrial Drive, Ypsilanti, MI 48198

J. Manuf. Sci. Eng 125(4), 816-823 (Nov 11, 2003) (8 pages) doi:10.1115/1.1617286 History: Received February 01, 2002; Revised March 01, 2003; Online November 11, 2003
Copyright © 2003 by ASME
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References

An excellent compilation of articles dealing with future developments in MEMS are available in this issue, 1996, Sens. Actuators A, 56 , pp. 1–197.
Lang,  Walter, 1999, “Reflexions on the Future of Microsystems,” Sens. Actuators A, 72, pp. 1–15.
Bhaskar,  E. V., and Aden,  J. S., 1985, “Development of the Thin-film Structure for the Thinkjet Printhead,” Hewlett-Packard J., 36(5), pp. 7–33.
Smith,  L., Soderbarg,  A., and Bjorkengren,  U., 1994, “Continuous Ink-jet Print Head Utilizing Silicon Micromachined Nozzles,” Sens. Actuators A, 43(1–3), pp. 256–261.
Cho, S. T., 1991, “An Ultrasensitive Silicon Pressure Based Microflow Sensor,” Ph.D. thesis, University of Michigan.
Jordan,  G. R., 1985, “Sensor Technologies of the Future,” J. Phys. E, 18, pp. 729–735.
Baltes,  Henry, 1993, “Microsensors Between Physics and Technology,” Phys. Scr., T49, pp. 449–453.
Benecke, W., 1991, “Silicon-Microactuators: Activation Mechanisms and Scaling Problems,” Transducers 91: 6th Intl. Conf. on Solid State Sensors and Actuators, San Francisco, pp. 46–50.
Thielicke,  E., and Obermeier,  E., 2000, “Microactuators and Their Technologies,” Mechatronics, 10, pp. 431–455.
Young, W. C., 1989, Roark’s Formulas for Stress and Strain, 6th Ed., McGraw-Hill, New York.
Tadigadapa, Srinivas, and Massoud-Ansari, Sonbol, 1999, “Applications of High-performance MEMS Pressure Sensors using Dissolved Wafer Process (DWP),” Proceedings of MEMS/MST/Microsystems Session, Sensors Expo, Baltimore.
Ashraf, H., Bhardwaj, J. K., Hall, S., Hopkins, J., Hynes, A. M., Johnston, I., McAuley, S., Nicholls, G., Atabo, L., Ryan, M. E., and Watcham, S. C., 2000, “Advances in Deep Anisotropic Silicon Etch Processing for MEMS,” Proc. 5th Natl. Conf. on Sensors and Microsystems, Lecce, Italy.
Huijsing,  J. H., Riedjik,  F. R., and van der Horn,  G., 1994, “Developments in Integrated Smart Sensors,” Sens. Actuators A, 43, pp. 276–288.
Bartelink,  D. J., 1996, “Integrated Systems,” IEEE Trans. Electron Devices, 43, pp. 1678–1687.
Ohlckers,  P., and Jakobsen,  H., 1998, “Challenges of the Emerging Microsystems Industry,” Microelectron. J., 29, pp. 587–600.
Delapierre,  G., 1989, “Micromachining: A Survey of the Most Commonly Used Processes,” Sens. Actuators 17, pp. 123–138.
Benecke,  W., 1990, “Silicon Micromachining for Microsensors and Microactuators,” Microelectron. Eng., 11, pp. 73–82.
Benavides,  G. L., Bieg,  L. F., and Saavedra,  M. P., 2002, “High Aspect Ratio Mesoscale Parts Enabled by Wire Micro-EDM,” Microsystem Technologies, 8(6), pp. 395–401.
Yeo,  S. H., and Yap,  G. G., 2001, “A Feasibility Study on the Micro-EDM Process for Photomask Fabrication,” Intl. J. of Advanced Manufacturing Technology, 18(1), pp. 7–11.
Kovacs,  G. T. A., Maluf,  N. I., and Petersen,  K. E., 1998, “Bulk Micromachining of Silicon,” Proc. IEEE, 86, pp. 1536–1551.
Baltes,  H., 1993, “CMOS as Sensor Technology,” Sens. Actuators A, 37–38, pp. 51–56.
Linder,  C., Paratte,  L., Gretillat,  M.-A., Jaecklin,  V. P., and de Rooij,  N. F., 1992, “Surface Micromachining,” J. Micromech. Microeng., 2, pp. 122–132.
Baltes,  Henry, 1993, “CMOS as Sensor Technology,” Sens. Actuators A, 37–38, pp. 51–56.
Gianchandani,  Y. B., and Najafi,  K., 1992, “A Bulk Silicon Dissolved Wafer Process for Microelectromechanical Devices,” J. Microelectromech. Syst., 1, pp. 77–85.
Bacher,  W., Menz,  W., and Mohr,  J., 1995, “The LIGA Technique and Its Potential for Microsystems—A Survey,” IEEE Trans. Ind. Electron., 42, pp. 431–441.
Senturia,  S. D., 1998, “CAD Challenges for Microsensors, Microactuators, and Microsystems,” Proc. IEEE, 86, pp. 1611–1626.
http://www.conventor.com
http://www.intellisense.com
http://www.memscap.com
Malshe,  A. P., O’Neal,  C., Singh,  S. B., Brown,  W. D., Eaton,  W. P., and Miller,  W. M., 1999, “Challenges in the Packaging of MEMS,” International Journal of Microcircuits and Electronic Packaging, 22, pp. 233–41.
Butler,  J. T., Bright,  V. M., and Comtois,  J. H., 1998, “Multichip Module Packaging of Microelectromechanical Systems,” Sens. Actuators A, 70, pp. 15–22.
Gilleo,  K., 2000, “MEMS Packaging Issues and Materials,” Adv. Microelectron., 27, pp. 9–13.
Smith,  R. L., and Collins,  S. D., 1988, “Micromachined Packaging for Chemical Microsensors,” IEEE Trans. Electron Devices, 35, pp. 787–792.
Dyrbye,  K., Brown,  T. R., and Eriksen,  G. F., 1996, “Packaging of Physical Sensors for Aggressive Media Applications,” J. Micromech. Microeng., 6, pp. 187–192.
Minami, K., Moriuchi, T., and Esashi, M., 1995, “Cavity Pressure Control for Critical Damping of Packaged Micromechanical Devices,” Proc. 8th Intl. Conf. on Solid State Sensors and Actuators, Stockholm, Sweden, pp. 240–243.
Von Arx, J., Ziaie, B., Dokmeci, M., and Najafi, K., 1995, “Hermeticity of Glass-silicon Packages with On-chip Feedthroughs,” Proc. 8th Intl. Conf. on Solid State Sensors and Actuators, Stockholm, Sweden.
de Reus,  R., , 1998, “Reliability of Industrial Packaging for Microsystems,” Microelectron. Reliab., 38, pp. 1251–1260.
Hruby, J., Kassicieh, S. K., and Walsh, S. T., 2000, “Commercialization of Disruptive Technologies: The Process of Discontinuous Innovations,” Proceedings of the 2000 IEEE Engineering Management Society, 2000, pp. 335–339.
Horntvedt, S., 1995, “Industrialization of an R&D Sensor Company,” Proc. 8th Intl. Conf. on Solid State Sensors and Actuators, Stockholm, Sweden, pp. 902–906.
Ansermet,  S., 1993, “Industrial Development of Micromechanical Devices: From Academic Protypes to Volume Production,” J. Micromech. Microeng., 3, pp. 225–228.
Punkka,  E., 1997, “Silicon Micromachined Sensors: From Lab to Fab,” Future Fab International, 3, pp. 65–68.
Frazier,  A. B., Warrington,  R. O., and Friedrich,  C., 1995, “The Miniaturization Technologies: Past, Present, and Future,” IEEE Trans. Ind. Electron., 42, 423–430.

Figures

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Size (Linear dimension) dependence of common forces and phenomena
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The top view of the ultra-sensitive, vacuum absolute pressure sensor
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Cost of production of MEMS chip as a function of the number of wafer and the number of chips per wafer. Further, the following assumptions have been made: Non-recurring Development Cost of $1 Million, and Production Cost/Wafer of $1000.
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Schematic diagram of Dissolved Wafer Process
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Calculated increase in cavity pressure as a function of time for a 4 mm×100 μm high hermetically sealed cavity
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Performance of the main and reference capacitors measured after 3.5 million cycles shows no detectable variations in the deflection sensitivity of the diaphragm
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Evaluation of protective coatings by measuring the etch (corrosion) depths in an accelerated gaseous environment
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Projected sales of MEMS devices by technology area. (Courtesy: System Planning Corporation Report 1999).

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