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TECHNICAL PAPERS

Fracture Mechanism of Laser Cutting With Controlled Fracture

[+] Author and Article Information
Chwan-Huei Tsai, Chi-Sheng Liou

Institute of Mechatronic Engineering, Huafan University, 1, Huafan Road, Shih-ting Hsiang, Taipei Hsien, Taiwan 223, Republic of China

J. Manuf. Sci. Eng 125(3), 519-528 (Jul 23, 2003) (10 pages) doi:10.1115/1.1559163 History: Received December 01, 2000; Revised October 01, 2002; Online July 23, 2003
Copyright © 2003 by ASME
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References

Figures

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Configuration of laser cutting system with controlled fracture technique
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Separation surface and cross section along the cutting path for (a) cutting speed 2 mm/s, (b) cutting speed 10 mm/s
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Lagging distance of the crack tip to the laser spot for cutting alumina substrates
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Fracture trajectory deviate from the laser moving path for cutting (a) straight line, (b) curved line, and (c) right angle
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The cutting speeds for different specimen size
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The maximum cutting speeds for different laser spot size
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The fracture surfaces of the alumina ceramic substrates for (a) controlled fracture, (b) laser scribing, and (c) laser melting
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Unstable fracture due to the main crack link with a small hole (A: Cutting direction, B: Small hole, C: Unstable fracture)
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Half of the specimen and coordinates system
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Stress distribution of σyy for the stage I—fracture initiation, z=0.544 mm
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Temperature distribution
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Stress distribution of σyy for the stage II—stable fracture, the crack tip lags behind the laser spot by 1 mm
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Stress distribution of σyy for the stage II—stable fracture, the crack tip lags behind the laser spot by 6 mm
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Stress state between the crack tip and laser spot
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Stress distribution of σyy for the stage III-unstable fracture, the distance between the laser spot and specimen edge is 9.6 mm
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Stress distribution of σyy for the stage II-stable fracture, the crack tip lags behind the laser spot by 2 mm
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Stress distribution of σyy for the stage II-stable fracture, the crack tip lags behind the laser spot by 6 mm. fσyy

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