A Fracture Mechanics Approach to Modeling Strength Degradation in Ceramic Grinding Processes

[+] Author and Article Information
Kai Xiong Hu, Abhijit Chandra

Department of Aerospace and Mechanical Engineering, The University of Arizona, Tucson, AZ 85721

J. Eng. Ind 115(1), 73-84 (Feb 01, 1993) (12 pages) doi:10.1115/1.2901642 History: Received May 01, 1992; Online April 08, 2008


Strength degradation of the finished part due to surface and sub-surface damage is a critical issue in grinding of ceramic materials. In this paper, the chip formation process is modeled as a two-dimensional system of radial and lateral cracks, and an integral equation approach is developed to investigate the interactions of these radial and lateral cracks with various distributions of planar microcracks. The effects in the vicinity of the free surface are modeled explicitly. The amplification and shielding effects on stress intensity factors due to various microcrack distributions are studied in detail. Numerical results are presented for crack systems representing single-grit as well as multi-grit grinding, and the implications of crack interactions on strength degradation of finished products are discussed. Effective elastic properties for workpieces containing microcrack distributions are obtained and their ramifications on the grinding process are investigated. Some benevolent microcrack distributions that will facilitate chip formation as well as suppress surface and subsurface damage evolution are also presented.

Copyright © 1993 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In