0
TECHNICAL PAPERS

Cost-Effective Grinding of Zirconia Using the Dense Vitreous Bond Silicon Carbide Wheel

[+] Author and Article Information
Albert J. Shih

Department of Mechanical Engineering, University of Michigan, Ann Arbor, MI 48109e-mail: shiha@umich.edu

Ronald O. Scattergood

Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695

Adam C. Curry

Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, NC 27695

Thomas M. Yonushonis, Darryl J. Gust, Marion B. Grant

Cummins Technical Center, Columbus, IN 47202

Samuel B. McSpadden, Thomas R. Watkins

High Temperature Materials Laboratory, Oak Ridge National Laboratory, Oak Ridge, TN 37831

J. Manuf. Sci. Eng 125(2), 297-303 (Apr 15, 2003) (7 pages) doi:10.1115/1.1559167 History: Received June 01, 2002; Revised November 01, 2002; Online April 15, 2003
Copyright © 2003 by ASME
Your Session has timed out. Please sign back in to continue.

References

Mandler, W. F., Yonushonis, T. M., Shinosawa, K., 1997, “Ceramic Successes in Diesel Engines,” 6th International Symposia on Ceramic Materials and Components for Engines, Arita-Machi, Japan, Oct. 19–23.
Shih,  A. J., and Akemon,  J. L., 2001, “Wear of the Blade Diamond Tools in Truing Vitreous Bond Grinding Wheels. Part I—Wear Measurement and Results,” Wear, 250, pp. 587–592.
Shih,  A. J., Akemon,  J. L., and Clark,  W. I., 2001, “Wear of the Blade Diamond Tools in Truing Vitreous Bond Grinding Wheels. Part II—Truing and Grinding Forces and Wear Mechanism,” Wear, 250, pp. 593–603.
Shih, A. J., and Yonushonis, T. M., 2000, “High Infeed Rate Method for Grinding Ceramic Workpiece with Silicon Carbide Grinding Wheels,” US Patent Number 6,030,277.
Malkin, S., 1989, Grinding Technology, Theory and Application of Machining with Abrasives, Ellis Horwood, p. 26.
Shih,  A. J., Yonushonis,  T. M., Grant,  M. B., Morris,  T. O., and McSpadden,  S. B., 1998, “Vitreous Bond CBN Wheel for High Speed Grinding of Zirconia and M2 Steel,” Transaction of 26th NAMRC, pp. 195–200.
Shih,  A. J., 2000, “An Experimental Investigation of Rotary Truing and Dressing of Vitreous Bond Wheels for Ceramic Grinding,” Int. J. Mach. Tools Manuf., 40, pp. 1755–1774.
Hwang,  T. W., Evans,  C. J., and Malkin,  S., 1999, “Size Effect for Specific Energy in Grinding of Silicon Nitride,” Wear, 225, pp. 862–867.
Malkin,  S., and Hwang,  T. W., 1996, “Grinding Mechanisms for Ceramics,” CIRP Ann., 45(2), pp. 569–580.
Bifano,  T. G., Dow,  T. A., and Scattergood,  R. O., 1991, “Ductile-Regime Grinding: A New Technology for Machining Brittle Materials,” ASME J. Eng. Ind., 113, pp. 184–189.
Stevens, R., 1986, Zirconia and Zirconia Ceramics, Magnesium Elektron Publication No. 113, Magnesium Elektron, Ltd., Manchester, U.K.
Garvie,  R. C., and Nicholoson,  P. S., 1972, “Phase Analysis in Zirconia Systems,” J. Am. Ceram. Soc., 55, pp. 303–305.
Guo,  C., and Malkin,  S., 1995, “Analysis of Energy Partition in Grinding,” ASME J. Eng. Ind., 117, pp. 55–61.
Ju,  Y., Farris,  T. N., and Chandrasekar,  S., 1998, “Theoretical Analysis of Heat Partition and Temperature in Grinding,” ASME J. Tribol., 120, pp. 789–794.
Curry, A. C., Shih, A. J., Kong, J., Scattergood, R. O., and McSpadden, S. B., “Grinding Temperature Measurements in MgO-PSZ Using Infrared Spectrometry,” J. Am. Ceram. Soc., in press.
Kohli,  S., Guo,  C., and Malkin,  S., 1995, “Energy Partition to the Workpiece for Grinding with Aluminum Oxide and CBN Abrasive Wheels,” ASME J. Eng. Ind., 117, pp. 160–168.
Guo,  C., Wu,  Y., Varghese,  V., and Malkin,  S., 1999, “Temperatures and Energy Partition for Grinding With Vitrified CBN Wheels,” CIRP Ann., 49(1), pp. 247–250.
Zhu,  B., Guo,  C., and Malkin,  S., 1995, “Energy Partition to the Workpiece for Grinding of Ceramics,” CIRP Ann., 44(1), pp. 267–271.

Figures

Grahic Jump Location
Setup of the grinding tests, (a) fixture and ceramic workpiece and (b) grinding wheel and workpiece
Grahic Jump Location
G-ratio vs. specific material removal rate for grinding tests conducted using Machines A and B
Grahic Jump Location
G-ratio in SiC grinding of different ceramics
Grahic Jump Location
Specific grinding forces for SiC grinding of MgO-PSZ
Grahic Jump Location
Dimensionless specific grinding energy vs. maximum undeformed chip thickness
Grahic Jump Location
SEM micrographs of SiC and diamond-ground MgO-PSZ surfaces. (MRR: Material Removal Rate)
Grahic Jump Location
Debris of SiC- and diamond-ground MgO-PSZ
Grahic Jump Location
Comparison of thermal conductivity of abrasive and work materials

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In