Cost-Effective Grinding of Zirconia Using the Dense Vitreous Bond Silicon Carbide Wheel

[+] Author and Article Information
Albert J. Shih

Department of Mechanical Engineering, University of Michigan, Ann Arbor, MI 48109e-mail: shiha@umich.edu

Ronald O. Scattergood

Department of Materials Science and Engineering, North Carolina State University, Raleigh, NC 27695

Adam C. Curry

Department of Mechanical and Aerospace Engineering, North Carolina State University, Raleigh, NC 27695

Thomas M. Yonushonis, Darryl J. Gust, Marion B. Grant

Cummins Technical Center, Columbus, IN 47202

Samuel B. McSpadden, Thomas R. Watkins

High Temperature Materials Laboratory, Oak Ridge National Laboratory, Oak Ridge, TN 37831

J. Manuf. Sci. Eng 125(2), 297-303 (Apr 15, 2003) (7 pages) doi:10.1115/1.1559167 History: Received June 01, 2002; Revised November 01, 2002; Online April 15, 2003
Copyright © 2003 by ASME
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Comparison of thermal conductivity of abrasive and work materials
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Debris of SiC- and diamond-ground MgO-PSZ
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SEM micrographs of SiC and diamond-ground MgO-PSZ surfaces. (MRR: Material Removal Rate)
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Dimensionless specific grinding energy vs. maximum undeformed chip thickness
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Specific grinding forces for SiC grinding of MgO-PSZ
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G-ratio in SiC grinding of different ceramics
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G-ratio vs. specific material removal rate for grinding tests conducted using Machines A and B
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Setup of the grinding tests, (a) fixture and ceramic workpiece and (b) grinding wheel and workpiece



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