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TECHNICAL PAPERS

Laser-Assisted Machining of Reaction Sintered Mullite Ceramics

[+] Author and Article Information
Patrick A. Rebro, Yung C. Shin

School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907

Frank P. Incropera

College of Engineering, University of Notre Dame, South Bend, IN

J. Manuf. Sci. Eng 124(4), 875-885 (Oct 23, 2002) (11 pages) doi:10.1115/1.1511523 History: Received June 01, 2001; Revised January 01, 2002; Online October 23, 2002
Copyright © 2002 by ASME
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References

Figures

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(a) Axial and (b) circumferential positions of the cutting tool, laser and pyrometer in the experimental setup
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The laser power ramping method employed during LAM of mullite
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Normalized specific cutting energy and estimated average material removal temperature as a function of final laser power
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Normalized specific cutting energy and estimated average material removal temperature as a function of feedrate
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Normalized specific cutting force data (with respect to nominal conditions) for variations in laser power and depth-of-cut
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Material removal temperature and ratio of feed force to main cutting force for variation in laser power
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Optical micrographs of chips collected during LAM of mullite at laser power settings of (a) 0 W, (b) 150 W, (c) 170 W, (d) 190 W, and (e) 210 W
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SEM micrographs of a chip formed during the nominal case (Case 1) for LAM of mullite at (a) 400× and (b) 3000×
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Variation of average flank wear (VB) with machining time
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Optical micrographs of tool wear on the (a) rake and (b) flank faces at t=6.25 min for room temperature machining
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Optical micrographs of tool wear on the (a) rake and (b) flank faces at t=20.8 min for T=1043 °C
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SEM micrographs of the (a) machined (nominal conditions, Case 1) and (b) ground mullite surfaces at 1000×.
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SEM micrograph of showing cross-sectional views of the (a) machined (nominal conditions, Case 1) and (b) ground mullite surfaces
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Surface roughness profiles for the (a) machined (nominal conditions, Case 1) and (b) ground mullite surfaces

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