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RESEARCH PAPERS

The Abrasive Cut-off Operation With Oscillation

[+] Author and Article Information
R. Murata

Mechanical Engineering Laboratory, Tokyo, Japan

M. C. Shaw

Mechanical Engineering Dept., Carnegie-Mellon University, Pittsburgh, Pa.

J. Eng. Ind 98(2), 410-422 (May 01, 1976) (13 pages) doi:10.1115/1.3438891 History: Received March 22, 1974; Online July 15, 2010

Abstract

In the abrasive cut-off operation in which a thin rotating disk is plunged through a workpiece, chips must be stored as a grain traverses the entire width of work being ground. Also, heat flows radially inward from the wheel surface for a longer time the wider the workpiece, thus increasing the tendency to overheat the polymeric bond posts that hold the abrasive grains in place. Oscillation of the workpiece in a tangential direction tends to reduce the length of continuous contact between abrasive grain and work and significantly improves grinding performance when relatively wide workpieces are ground. This paper discusses the more important aspects of the abrasive cut-off operation with oscillation.

Copyright © 1976 by ASME
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