Analysis and Temperature Control of Hybrid Microcircuits

[+] Author and Article Information
J. T. Pogson, J. L. Franklin

Boeing Aerospace Co., Kent, Wash.

J. Eng. Ind 95(4), 1048-1052 (Nov 01, 1973) (5 pages) doi:10.1115/1.3438250 History: Received April 17, 1973; Online July 15, 2010


The results of a study on thermal modeling and analysis of hybrid microcircuits are presented. Parametric studies covering typical component mounting methods, bonding agent materials, and component spacing are described. Temperature profiles of substrates, component temperatures, and thermal resistances are presented. It is shown that the use of moly tabs can significantly reduce component temperature levels. Additionally, it is shown that thermal modeling can greatly aid the circuit designer in the layout and preliminary design phases.

Copyright © 1973 by ASME
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