0
RESEARCH PAPERS

Simulation Study of the Grinding Process

[+] Author and Article Information
S. S. Law

Singapore Polytechnic, Singapore

S. M. Wu

Department of Mechanical Engineering, University of Wisconsin, Madison, Wisc.

J. Eng. Ind 95(4), 972-978 (Nov 01, 1973) (7 pages) doi:10.1115/1.3438277 History: Received July 31, 1972; Online July 15, 2010

Abstract

A model in terms of grain distributions and kinematic conditions has been recently developed [8] for a specified grinding process. Using this model, an exploratory attempt was made to study the grinding process with respect to the surface topography and nature of surface interactions by simulation on a digital computer. Fundamental grinding parameters, such as the effective grain density, grain spacings, chip depths, and chip areas, are employed to describe the grain-workpiece interactions. The grinding process is studied under a systematic variation of table speed, wheel depth of cut, and grain apex angle. The physical significance of the Z-distribution and stochastic nature of the grinding process is also discussed.

Copyright © 1973 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In