Simulation Study of the Grinding Process

[+] Author and Article Information
S. S. Law

Singapore Polytechnic, Singapore

S. M. Wu

Department of Mechanical Engineering, University of Wisconsin, Madison, Wisc.

J. Eng. Ind 95(4), 972-978 (Nov 01, 1973) (7 pages) doi:10.1115/1.3438277 History: Received July 31, 1972; Online July 15, 2010


A model in terms of grain distributions and kinematic conditions has been recently developed [8] for a specified grinding process. Using this model, an exploratory attempt was made to study the grinding process with respect to the surface topography and nature of surface interactions by simulation on a digital computer. Fundamental grinding parameters, such as the effective grain density, grain spacings, chip depths, and chip areas, are employed to describe the grain-workpiece interactions. The grinding process is studied under a systematic variation of table speed, wheel depth of cut, and grain apex angle. The physical significance of the Z-distribution and stochastic nature of the grinding process is also discussed.

Copyright © 1973 by ASME
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