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TECHNICAL BRIEFS

Experimental Investigation of Polymeric Material Removal by Low Diffraction Laser Beam

[+] Author and Article Information
Xuanhui Lu, Y. Lawrence Yao, Kai Chen

Department of Mechanical Engineering, Columbia University, 220 Mudd Bldg., MC 4703, New York, NY 10027

J. Manuf. Sci. Eng 124(2), 475-480 (Apr 29, 2002) (6 pages) doi:10.1115/1.1445156 History: Received November 01, 1999; Revised February 01, 2001; Online April 29, 2002
Copyright © 2002 by ASME
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References

Siegman, A. E., 1993, “Defining and Measuring Laser Beam Quality,” Solid State Laser-New Developments and Applications, M. Inguscio and R. Wallenstein, eds., Plenum, New York, pp. 13–28.
Wang,  S., Lu,  X., Pan,  C., and Yu,  S., 1995, “A New Beam CO2 Laser,” Optik (Stuttgart), 101, pp. 32.
Wang,  S. , 1995, “A New Beam Produced by CO2 laser,” Optik (Stuttgart), 101, pp. 84.
Yibas,  B. S., 1987, “Study of Affecting Parameters in Laser Hole Drilling of Sheet Metals,” ASME J. Eng. Mater. Technol., 109, pp. 282–287.
Olson,  R. W., and Swope,  W. C., 1993, “Laser Drilling with Focused Gaussian Beams,” J. Appl. Phys., 72, No. 8, pp. 3686–3696.
Rohde, H., and Dausinger, F., 1995, “The Forming Process of a Through Hole Drilled with a Single Laser Pulse,” ICALEO’95, pp. 331–340.
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Redmond,  T. F., Lankard,  J. R., Balz,  J. R., Proto,  G. R., and Wassick,  T. A., 1993, “The Application of Laser Process Technology to Thin Film Packaging,” IEEE Trans. Compon., Hybrids, Manuf. Technol., 16, No. 1, pp. 6–12.
Batteh, J. J., Chen, M. M., and Mazumder, J., 1998, “Scaling and Numerical Analysis of Pulsed Laser Drilling,” ICALEO’98, B-30.
Powell, J., 1993, CO2Laser Cutting, Springer-Verlag.
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Collins,  S. A., 1970, “Lens-System Diffraction Integral Written in Term of Matrix Optics,” J. Opt. Soc. Am., 60, No. 9, pp. 1168–1177.
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Figures

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Schematic of resonator configuration (with a half phase plate attached on the rear mirror inside laser cavity) to realize the low diffraction beam
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Beam radius of the measured low diffraction beam and theoretical TEM00 mode vs. axial distance between the output coupler to the measurement location
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Intensity distributions (calculations are based on Eqs. (2) and (3), with W0=1.49 mm (experimentally measured) and Me2=0.3 (using Eq. (1)))
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Acrylic imprints with Gaussian (left) and the low diffraction beam (right) (9W, 1 sec, both unfocused)
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Theoretical (dotted line) and experimental results (solid line) of hole profiles (power=9 W,duration=1 sec, unfocused, acrylic)
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The hole taper vs. ablation power (ablation duration=0.8 sec, focused, acrylic)
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Drilling depth comparison between the Gaussian beam and the low diffraction beam vs. ablation duration (focused, acrylic)
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Drilled hole diameter comparison between the Gaussian beam and the low diffraction beam vs. ablation time (focused, acrylic)
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(a) Hole diameter and (b) depth vs. the distance from focus lens to workpiece top surface (focal length=4 cm,power=7 W,duration=0.5 sec)
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Typical groove profiles with Gaussian beam and the low diffraction beam (power=9 W,speed=14 mm/sec, both focused, acrylic)

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