RESEARCH PAPERS: Other Technical Papers

Analysis of Temperature Field in Chip

[+] Author and Article Information
M. Y. Friedman, E. Lenz

Technion–Israel Institute of Technology, Haifa, Israel

J. Eng. Ind 95(1), 317-320 (Feb 01, 1973) (4 pages) doi:10.1115/1.3438129 History: Received July 24, 1972; Online July 15, 2010


A solution is presented for the temperature field in the chip under experimental edge conditions in the contact zone and at the upper chip face. The pattern of the temperature gradient in the chip normal to the tool face while turning steel with hard-metal tools is analyzed.

Copyright © 1973 by ASME
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