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TECHNICAL PAPERS

The Process Window for Reference Free Part Encapsulation

[+] Author and Article Information
Elmer Lee, Paula Valdivia, Winston Fan, Sanjay E. Sarma

Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139

J. Manuf. Sci. Eng 124(2), 358-368 (Apr 29, 2002) (11 pages) doi:10.1115/1.1414126 History: Received October 01, 2000; Revised February 01, 2001; Online April 29, 2002
Copyright © 2002 by ASME
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References

Figures

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Reference Free Part Encapsulation: a new prototyping technology
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Re-welding and drift problems
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Breaking down the weld by super-heating the injected metal
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Diagram of the algorithm to solve the heat transfer problem using Runga Kutta and the proper governing equations
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Modeling heat transfer for re-welding
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How the maximum penetration depth changes with Θ for given cooling rates
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The process window for re-welding with tensile test results superimposed
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Simulation for predicting re-welding
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Results of simulation for drift
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The process window for pre-heat and injection temperatures
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Surface roughness under fixturing load
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Mold for Bi/Sn replication test
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Experimental results from imprint tests
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Process window for pressure and surface roughness
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Pictures of failed section showing increasing ductility
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Tensile test results for re-welds in different regimes
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The re-welding mold and process
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The temporary retreat of the solidification front as predicted by the simulation
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Pratt & Whitney blades [Sprenkle 97]

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