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TECHNICAL PAPERS

Scratching Test of Hard-Brittle Materials Under High Hydrostatic Pressure

[+] Author and Article Information
Masahiko Yoshino

Department of Mechano-Aerospace Engineering Tokyo Institute of Technology, 2-12-1 O-Okayama, Meguroku, Tokyo 152-8552, Japan

Takayuki Aoki

Department of Mechanical Environmental Engineering, Tokyo Institute of Technology, 2-12-1 O-Okayama, Meguroku, Tokyo 152-8552, Japan

Takahiro Shirakashi

Department of Precision Machining Engineering, Tokyo Denki University, 2-2 Kanda-Nishikicho, Chiyoda-ku, Tokyo 101, Japan

J. Manuf. Sci. Eng 123(2), 231-239 (Apr 01, 2000) (9 pages) doi:10.1115/1.1347035 History: Received August 01, 1999; Revised April 01, 2000
Copyright © 2001 by ASME
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References

Figures

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Measured length of lateral cracks along a trace
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Geometry of the pin and the trace
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SEM micrographs of traces on silicon wafers
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Optical micrographs of traces on glass plates
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SEM micrographs of traces on quartz wafers
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Profiles of cross section of traces formed under 400 MPa (a) silicon, (b) glass, (c) quartz
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Effects of hydrostatic pressure on the crack ratio in scratching processes (a) silicon (b) glass (c) quartz
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Schematics indicating the origin of cracks on machined surface
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SEM micrography of the single crystal diamond pin used for the experiments
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Cross-section of the machining tester under high hydrostatic pressure 1○ pressure vessel 2○ pressure intake hole 3○ turntable 4○ angular bearing 5○ sleeve 6○ Bridgeman seal 7○ Bridgeman seal 8○ lid 9○ bolt 10○ specimen 11○ diamond pin 12○ tool holder 13○ fulcrum of the tool holder 14○ spring 15○ spring adjuster

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