0
TECHNICAL PAPERS

Scratching Test of Hard-Brittle Materials Under High Hydrostatic Pressure

[+] Author and Article Information
Masahiko Yoshino

Department of Mechano-Aerospace Engineering Tokyo Institute of Technology, 2-12-1 O-Okayama, Meguroku, Tokyo 152-8552, Japan

Takayuki Aoki

Department of Mechanical Environmental Engineering, Tokyo Institute of Technology, 2-12-1 O-Okayama, Meguroku, Tokyo 152-8552, Japan

Takahiro Shirakashi

Department of Precision Machining Engineering, Tokyo Denki University, 2-2 Kanda-Nishikicho, Chiyoda-ku, Tokyo 101, Japan

J. Manuf. Sci. Eng 123(2), 231-239 (Apr 01, 2000) (9 pages) doi:10.1115/1.1347035 History: Received August 01, 1999; Revised April 01, 2000
Copyright © 2001 by ASME
Your Session has timed out. Please sign back in to continue.

References

Yoshikawa,  H., 1969, “Brittle-Ductile Behavior of Crystal Surface in Finishing,” Journal of the Japan Society for Precision Engineering, 35-10, pp. 662–667.
Puttick,  K. E., Rudman,  M. R., Smith,  K. J., Franks,  A., and Lindsey,  K., 1989, “Single-Point Diamond Machining of Glasses,” Proc. R. Soc. London, Ser. A, 426, pp. 19–30.
Nakatsuji,  T., Kodera,  S., Hara,  S., Matsunaga,  H., Ikawa,  N., and Shimada,  S., 1990, “Diamond Turning of Brittle Materials for Optical Compornets,” CIRP Ann., 39-1, pp. 89–92.
Blake,  P. N., and Scattergood,  R. O., 1990, “Ductile-Regime Machining of Germanium and Silicon,” J. Am. Ceram. Soc., 73-4, pp. 949–957.
Ichida,  Y., Kishi,  K., Hasuta,  Y., and Akbari,  J., 1991, “Study on Mirror Finish Grinding of Fine Ceramics (1st report),” J. Soc. Precis. Eng., 57-8, pp. 1406–1412.
Bifano,  T. G., Dow,  T. A., and Scattergood,  R. O., 1991, “Ductile-Regime Grinding: A New Technology for Machining Brittle Materials,” ASME J. Eng. Ind., 113, pp. 184–189.
Wu,  T., Morita,  N., and Yoshida,  K., 1993, “Study on the Diamond Cutting of Silicon Single Crystal (1st report),” Journal of Japan Society of Mechanical Engineering, C59-577, pp. 283–288.
Yoshino M., and Shirakashi, T., 1993, “Ductile Mode Cutting of Glass,” Proceedings of ICMT’93, pp. 1–6.
Shibata,  T., Ono,  A., Kurihara,  K., Makino,  E., and Ikeda,  M., 1994, “Cross-section Transmission Electron Microscope Observations of Diamond-turned Single Crystal Si Surfaces,” Appl. Phys. Lett., 65-20, pp. 2553–2555.
Kitagawa,  T., and Maekawa,  K., 1990, “Plasma Hot Machining for New Engineering Materials,” Wear, 139, pp. 251–267.
Moriwaki,  T., Shamoto,  E., and Inoue,  K., 1992, “Ultraprecision Ductile Cutting of Glass by Applying Ultrasonic Vibration,” CIRP Ann., 41-1, pp. 141–144.
Yoshino,  M., Aoki,  T., Sugishima,  T., and Shirakashi,  T., 1999, “Scratching Test on Hard-Brittle Materials under High Hydrostatic Pressure,” J. Soc. Precis. Eng., 65-10, pp. 1481–1485.
Hayashi,  K., Tsujimoto,  S., Okamoto,  Y., and Nishikawa,  T., 1991, “Fracture Toughness of Single Crystal Silicon,” J. Soc. Mater. Sci. Jpn., 40-451, pp. 405–410.
Hashimoto,  K., Sakane,  M., and Ohnami,  M., 1994, “Stress Intensity Factor for Semicircular Surface Crack Embedded in Si Single Crystal,” Journal of Japan Society of Mechanical Engineers, A60-570, pp. 317–323.
Marshall,  D. B., and Evans,  A. G., 1981, Reply to “Comment on ‘Elastic/Plastic Indentation Damage in Ceramics: The Median Radial Crack System,” J. Am. Ceram. Soc., 64, pp. C–182.
Swain,  M. V., 1997, “Microfracture about Scratches in Brittle Solids,” Proc. R. Soc. London, Ser. A, 366, pp. 575–597.
Bridgman,  P. W., 1947, “The Effect of Hydrostatic Pressure on the Fracture of Brittle Substances,” J. Appl. Phys., 18, pp. 246–259.
Crossland, B., and Dearden, W. H., 1958, “The Plastic Flow and Fracture of a ‘Brittle’ Material (Gray Cast Iron) with Particular Reference to the Effect of Fluid Pressure,” Proceedings of the Institution of Mechanical Engineers, 172 , pp. 805–820.
Handin,  J., Heard,  H. C., and Magouirk,  J. N., 1967, “Effects of the Intermediate Principal Stress on the Failure of Limestone, Dolomite, and Glass at Different Temperatures and Strain Rates,” J. Geophys. Res., 72-2, pp. 611–640.
Sakata,  M., and Aoki,  S., 1973, “Torsional Strength of Glass under Hydrostatic Pressure,” ASME J. Eng. Mater. Technol., 95-2, pp. 83–86.

Figures

Grahic Jump Location
Cross-section of the machining tester under high hydrostatic pressure 1○ pressure vessel 2○ pressure intake hole 3○ turntable 4○ angular bearing 5○ sleeve 6○ Bridgeman seal 7○ Bridgeman seal 8○ lid 9○ bolt 10○ specimen 11○ diamond pin 12○ tool holder 13○ fulcrum of the tool holder 14○ spring 15○ spring adjuster
Grahic Jump Location
SEM micrography of the single crystal diamond pin used for the experiments
Grahic Jump Location
Measured length of lateral cracks along a trace
Grahic Jump Location
Geometry of the pin and the trace
Grahic Jump Location
SEM micrographs of traces on silicon wafers
Grahic Jump Location
Optical micrographs of traces on glass plates
Grahic Jump Location
SEM micrographs of traces on quartz wafers
Grahic Jump Location
Profiles of cross section of traces formed under 400 MPa (a) silicon, (b) glass, (c) quartz
Grahic Jump Location
Effects of hydrostatic pressure on the crack ratio in scratching processes (a) silicon (b) glass (c) quartz
Grahic Jump Location
Schematics indicating the origin of cracks on machined surface

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In