Thermal Stresses in Spherical Case-Bonded Propellant Grains

[+] Author and Article Information
Irvin Krause

Research Division, American Standard, Union, N. J.

Bernard W. Shaffer

New York University, New York, N. Y.

J. Eng. Ind 84(1), 144-148 (Feb 01, 1962) (5 pages) doi:10.1115/1.3667394 History: Received March 06, 1961; Online December 09, 2011


Expressions are derived for the bond stresses induced by a radially symmetric temperature distribution in spherical propellant grains bonded to spherical casings. Equations for the evaluation of radial and tangential stresses in the propellant and its casing have also been derived. Both solid and hollow propellant grains have been investigated. Design considerations have been developed to enable the designer to minimize the bond stress. A comparison between the hollow and solid spherical propellant assembly shows that the hollow sphere has a lower bond stress than the solid sphere, assuming all other factors are the same.

Copyright © 1962 by ASME
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