A Photoelastic Analysis of Machining Stresses

[+] Author and Article Information
E. Usui, H. Takeyama

Government Mechanical Laboratory, Tokyo, Japan

J. Eng. Ind 82(4), 303-307 (Nov 01, 1960) (5 pages) doi:10.1115/1.3664233 History: Received July 14, 1958; Online December 09, 2011


Direct measurements of the distributions of normal and frictional stresses on a rake face under cutting conditions have been considered to be practically impossible. However, as reported in this paper, the stress distributions have been successfully obtained photoelastically by using a tool made of a photoelastic material. According to the authors’ experiment, the frictional stress on the rake face is distributed uniformly over a wide range of the tool-chip contact length, but it decreases rapidly near the point of chip-separation on the rake face. As to the normal stress, it has a peak near the cutting edge, being rather stationary in the middle part of the contact length and decreasing gradually toward the point of chip-separation.

Copyright © 1960 by ASME
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In