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TECHNICAL PAPERS

Experimental Evaluation of the Laser Assisted Machining of Silicon Nitride Ceramics

[+] Author and Article Information
Jay C. Rozzi, Frank E. Pfefferkorn, Yung C. Shin

Laser Assisted Materials Processing Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907

Frank P. Incropera

Aerospace and Mechanical Engineering Department, University of Notre Dame, Notre Dame, IN 46556

J. Manuf. Sci. Eng 122(4), 666-670 (Dec 01, 1999) (5 pages) doi:10.1115/1.1286556 History: Received September 01, 1998; Revised December 01, 1999
Copyright © 2000 by ASME
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References

Figures

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Surface temperature measurement locations during laser assisted machining
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Experimentally measured normalized specific cutting energy and chamfer surface temperature for two laser/tool translational velocities
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Experimentally measured normalized specific cutting energy and chamfer surface temperature as a function of laser power
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Classification of chips produced by the laser assisted machining of silicon nitride
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Ground silicon nitride workpiece surface for (a) 330× and (b) 3250×
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Silicon nitride workpiece surface resulting from LAM at the nominal operating conditions (v=1000 rpm,Vz=10 mm/min,d=1 mm,Ll=1 mm,Dl=2.5 mm,Pl=250 W), at (a) 330× and (b) 3250×

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