0
TECHNICAL PAPERS

Thermal Aspects of Grinding: The Case of Upgrinding

[+] Author and Article Information
Marios D. Demetriou, Adrienne S. Lavine

Mechanical and Aerospace Engineering Department, University of California, Los Angeles, Los Angeles, CA 90095-1597

J. Manuf. Sci. Eng 122(4), 605-611 (Sep 01, 1999) (7 pages) doi:10.1115/1.1285877 History: Received July 01, 1998; Revised September 01, 1999
Copyright © 2000 by ASME
Your Session has timed out. Please sign back in to continue.

References

Figures

Grahic Jump Location
(a) Upgrinding. (b) Downgrinding.
Grahic Jump Location
Grain and chip geometry
Grahic Jump Location
Temperatures in downgrinding
Grahic Jump Location
Temperatures in upgrinding
Grahic Jump Location
Temperatures in downgrinding with film boiling
Grahic Jump Location
Temperatures in upgrinding with film boiling
Grahic Jump Location
Temperatures in upgrinding with heat generation at shear planes
Grahic Jump Location
Experimental and predicted maximum temperature rise versus depth
Grahic Jump Location
The effect of heat conduction in the direction of motion
Grahic Jump Location
Maximum temperature rise versus fraction of active grains
Grahic Jump Location
Maximum temperature rise versus shear plane angle
Grahic Jump Location
Maximum temperature rise versus grain sharpness

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In