An Investigation of Material Removal Mechanisms in Lapping with Grain Size Transition

[+] Author and Article Information
Y. P. Chang

IBM, San Jose, CA 95113

M. Hashimura

Nippon Steel Corp., Sapporo, Japan

D. A. Dornfeld

Dept. of Mechanical Engineering, University of California, Berkeley, Berkeley, CA 94720

J. Manuf. Sci. Eng 122(3), 413-419 (Jan 01, 2000) (7 pages) doi:10.1115/1.1286471 History: Received December 01, 1997; Revised January 01, 2000
Copyright © 2000 by ASME
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Grahic Jump Location
Lapping experiment setup
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Modes of abrasive-work interaction
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Two dimensional abrasive shape used in 4
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Median and lateral cracks under an indenter 1617
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Machining states in the lapping processes
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Interaction among work, plate, and abrasive
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Assumed abrasive size distribution 5
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SEM pictures of lap plate with abrasives
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Distributions of abrasive size at different machining time (sample size: N15=62,N90=101,N180=100,N250=100)
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Theoretical and actual material removal rate (abrasive tip angle, ψ)



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