Curing of Composites Using Internal Resistive Heating

[+] Author and Article Information
B. Ramakrishnan, L. Zhu, R. Pitchumani

Composites Processing Laboratory, Department of Mechanical Engineering, University of Connecticut, U-139, Storrs, CT 06269-3139

J. Manuf. Sci. Eng 122(1), 124-131 (Jun 01, 1999) (8 pages) doi:10.1115/1.538913 History: Received December 01, 1998; Revised June 01, 1999
Copyright © 2000 by ASME
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Schematic of the experimental setup used for the resistive heating studies
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Variation of the average and maximum void fractions in the composite specimens for the seven configurations listed in Table 1
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Processing window on the feasible range of power inputs, obtained from the experimental study
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Determination of the heat of reaction, based on a nonisothermal DSC scan
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Model parameters for the kinetics of the EPON 815/EPICURE 3274 resin/catalyst system, obtained from isothermal DSC scans.
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Variation of the measured and model-predicted temperature histories through the thickness of the composite for (a) base heating only, and supplemental heating configurations: (b) 1cp1, (c) 2cp2, and (d) 3cp1
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Comparison of (a) experimentally established and (b) model-predicted values of the parameters Tmax,ΔTmax,Ṫmax, and tcure, normalized with respect to the base case, for the different heating configurations listed in Table 1
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Variation of the measured void fraction through the thickness of the composite for the supplemental heating configurations: (a) 1cp1 and (b) 3cp1




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