0
TECHNICAL PAPERS

Curing of Composites Using Internal Resistive Heating

[+] Author and Article Information
B. Ramakrishnan, L. Zhu, R. Pitchumani

Composites Processing Laboratory, Department of Mechanical Engineering, University of Connecticut, U-139, Storrs, CT 06269-3139

J. Manuf. Sci. Eng 122(1), 124-131 (Jun 01, 1999) (8 pages) doi:10.1115/1.538913 History: Received December 01, 1998; Revised June 01, 1999
Copyright © 2000 by ASME
Your Session has timed out. Please sign back in to continue.

References

Carrozino,  S., Levita,  G., Rolla,  P., and Tombari,  E., 1990, “Calorimetric and Microwave Dielectric Monitoring of Epoxy Resin Cure,” Polym. Eng. Sci., 30, pp. 366–373.
Lee,  W. I., and Springer,  G. S., 1984, “Interaction of Electromagnetic Radiation with Organic Matrix Composites,” J. Compos. Mater., 18, pp. 357–386.
Lee,  W. I., and Springer,  G. S., 1984, “Microwave Curing of Composites,” J. Compos. Mater., 18, pp. 387–409.
Butler, D., and Engel, R. S., 1994, “On the use of Embedded Graphite Patches for Cure in Resin Transfer Molding,” in Proceedings, ICCM-10, Whistler, Canada, pp. 269–275.
Sancaktar,  E., Weijian,  E. M., and Yurgartis,  S. W., 1993, “Electric Resistive Heat Curing of the Fiber-Matrix Interface in Graphite/Epoxy Composites,” ASME J. Mech. Des., 115, pp. 53–60.
VanDerSchuur, L., and Pitchumani, R., 1997, “A LabVIEW-based Process Control System for Composites Fabrication,” presented at the LabVIEW Virtual Instrumentation Education Conference, MIT, Cambridge, MA, May.
Han,  C. D., Lee,  D. S., and Chin,  H. B., 1986, “Development of a Mathematical Model for the Pultrusion Process,” Polym. Eng. Sci., 26, pp. 393–404.
Lem,  K. W., and Han,  C. D., 1983, “Chemorheology of Thermosetting Resin,” J. Appl. Polym. Sci., 28, pp. 3155–3183.
Kamal,  M. R., and Sourour,  S., 1976, “DSC of Epoxy Cure: Isothermal Kinetics,” Thermochim. Acta, 14, pp. 41–59.
Ning,  Q., and Chou,  T.-W., 1995, “A Closed-Form Solution of the Transverse Effective Thermal Conductivity of Woven Fabric Composites,” J. Compos. Mater., 29, pp. 2280–2294.
Condon, E. U., and Odishaw, H., 1967, Handbook of Physics, McGraw-Hill, New York.
Pitchumani,  R., Liaw,  P. K., Yao,  S. C., Jeong,  H., and Hsu,  D. K., 1995, “Theoretical Models for the Anisotropic Conductivities of Two-Phase and Three-Phase Metal-Matrix Composites,” Acta Metall. Mater., 43, pp. 3045–3059.
Incopera, F. P., and DeWitt, D. P., 1996, Fundamentals of Heat and Mass Transfer, Wiley, New York.
Rai,  N., and Pitchumani,  R., 1997, “Optimal Cure Cycles for the Fabrication of Thermosetting-matrix Composites,” Polym. Compos., 18, pp. 556–581.
Russ, J. C., 1995, The Image Processing Handbook, CRC, Boca Raton, FL.
Zhu,  L., and Pitchumani,  R., 1999, “Processing Envelopes for Supplemental Internal Resistive Heating during Thermosetting-Matrix Composite Cure,” J. Reinf. Plast. Compos., 18, No. 13, pp. 1242–1253.
Zhu, L., and Pitchumani, R., 1999, “Analysis and Design of a Thermosetting Matrix Cure Process with Supplemental Internal Resistive Heating,” Compos. Sci. Technol., submitted.

Figures

Grahic Jump Location
Schematic of the experimental setup used for the resistive heating studies
Grahic Jump Location
Determination of the heat of reaction, based on a nonisothermal DSC scan
Grahic Jump Location
Model parameters for the kinetics of the EPON 815/EPICURE 3274 resin/catalyst system, obtained from isothermal DSC scans.
Grahic Jump Location
Variation of the measured and model-predicted temperature histories through the thickness of the composite for (a) base heating only, and supplemental heating configurations: (b) 1cp1, (c) 2cp2, and (d) 3cp1
Grahic Jump Location
Comparison of (a) experimentally established and (b) model-predicted values of the parameters Tmax,ΔTmax,Ṫmax, and tcure, normalized with respect to the base case, for the different heating configurations listed in Table 1
Grahic Jump Location
Variation of the measured void fraction through the thickness of the composite for the supplemental heating configurations: (a) 1cp1 and (b) 3cp1
Grahic Jump Location
Variation of the average and maximum void fractions in the composite specimens for the seven configurations listed in Table 1
Grahic Jump Location
Processing window on the feasible range of power inputs, obtained from the experimental study

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In