0
TECHNICAL PAPERS

High Speed Grinding of Silicon Nitride With Electroplated Diamond Wheels, Part 2: Wheel Topography and Grinding Mechanisms

[+] Author and Article Information
T. W. Hwang, C. J. Evans

Manufacturing Engineering Laboratory, National Institute of Standards and Technology, Gaithersburg, MD 20899

S. Malkin

Department of Mechanical and Industrial Engineering, University of Massachusetts, Amherst, MA 01003-2210

J. Manuf. Sci. Eng 122(1), 42-50 (Jun 01, 1999) (9 pages) doi:10.1115/1.538909 History: Received December 01, 1998; Revised June 01, 1999
Copyright © 2000 by ASME
Your Session has timed out. Please sign back in to continue.

References

Malkin,  S., and Hwang,  T. W., 1996, “Grinding Mechanisms for Ceramics,” Ann. CIRP, 45, No. 2, pp. 569–580.
Tönshoff, H. K., Telle, R., and Roth, P., 1990, “Chip Formation and Material Removal in Grinding of Ceramics,” Proceedings of the 4th International Grinding Conference, Dearborn, MI, Oct. 9–11, 1990, Vol. 2, SME, Technical Paper MR90-539.
Chen, C., Jung, Y., and Inasaki, I., 1989, “Surface, Cylindrical and Internal Grinding of Advanced Ceramics,” Grinding Fundamentals and Applications, PED-Vol. 39, ASME, New York, NY, pp. 201–211.
Hwang,  T. W., and Malkin,  S., 1999, “Grinding Mechanisms and Energy Balance for Ceramics,” ASME J. Manuf. Sci. Eng., 121, pp. 623–631.
Shore,  P., 1990, “State of the Art in “Damage-Free” Grinding of Advanced Engineering Ceramics,” Br. Ceram. Proc., 46, pp. 189–200.
Ives,  L. K., Evans,  C. J., Jahanmir,  S., Polvani,  R. S., Strakna,  T. J., and Mcglauflin,  M. L., 1993, “Effect of Ductile-Regime Grinding on the Strength of Hot Isostatically-Pressed Silicon Nitride,” NIST Spec. Publ., 847, pp. 341–352.
Boettger,  J. M., Ker,  M. K., Shore,  P., and Stephenson,  D. J., 1993, “Influence of Ductile Mode Grinding on the Strength of Silicon Based Ceramics,” NIST Spec. Publ., 847, pp. 353–358.
Yoshioka, J., Hashimoto, F., Miyashita, M., Kanai, A., Abo, T., and Daito, M., 1985, “Ultra Precision Grinding Technology for Brittle Materials: Application to Surface and Centerless Grinding Process,” Milton C. Shaw Grinding Symposium, ASME, New York, NY, pp. 209–227.
Bifano,  T. G., Dow,  T. A., and Scattergood,  R. O., 1991, “Ductile Regime Grinding: A New Technology for Machining Brittle Materials,” ASME J. Eng. Ind., 113, pp. 184–189.
Hwang,  T. W., Evans,  C. J., Whitenton,  E. P., and Malkin,  S., 2000, “High Speed Grinding of Silicon Nitride with Electroplated Diamond Wheels, Part 1: Wear and Wheel Life,” ASME J. Manuf. Sci. Eng., 122, pp. 32–40.
Malkin,  S., and Cook,  N. H., 1971, “The Wear of Grinding Wheels Part I – Attritious Wear,” ASME J. Eng. Ind., 93, pp. 1120–1128.
Bendat, J. S., and Piersol, A. G., 1986, Random Data Analysis and Measurement Procedures, 2nd ed., J. Wiley & Sons, New York, NY.
Malkin, S., 1989, Grinding Technology: Theory and Application of Machining with Abrasives, Wiley, New York, reprinted by SME, Dearborn, MI.
Ishigaki,  H., Kawaguchi,  L., Iwasa,  M., and Toibana,  Y., 1986, “Friction and Wear of Hot Pressed Silicon Nitride and Other Ceramics,” ASME J. Tribol., 108, pp. 514–521.

Figures

Grahic Jump Location
Optical micrographs of wear flats (180 grit single-layer electroplated diamond wheel, silicon nitride workpiece): (a) wheel I, (a=50.8 μm,vw=63.5 mm/s,vs=85 m/s,t=1752 s), (b) wheel II, (a=50.8 μm,vw=63.5 mm/s,vs=149 m/s,t=1269 s), (c) wheel IV, (a=25.4 μm, vw=127 mm/s, vs=149 m/s, t=1752 s)
Grahic Jump Location
Optical micrograph of wear flats (180 grit single-layer electroplated diamond wheel with removable inserts, silicon nitride workpiece): (a=50.8 μm,vw=63.5 mm/s,vs=149 m/s,t=8.3 s)
Grahic Jump Location
SEM micrographs: (a) wheel cross section, (b) fresh wheel surface
Grahic Jump Location
Schematic illustration of single-layer plated wheel: (a) fresh wheel, (b) worn wheel
Grahic Jump Location
Measured protrusion height distribution of diamond abrasive grains and fitted normal probability density function
Grahic Jump Location
Active grain density versus wear depth
Grahic Jump Location
Wear flat area versus wear depth
Grahic Jump Location
Active grain density versus sliding length per unit material removal rate per unit width
Grahic Jump Location
Wear flat area versus sliding length per unit material removal rate per unit width
Grahic Jump Location
Grinding forces versus wear flat area
Grahic Jump Location
Crossplots of normal and tangential grinding forces per unit width
Grahic Jump Location
Average contact pressure plotted versus (a) curvature difference and (b) infeed angle
Grahic Jump Location
Specific grinding energy versus wear flat area
Grahic Jump Location
Illustration of undeformed chip geometry with trapezoidal cross section
Grahic Jump Location
Maximum undeformed chip thickness versus accumulated sliding length per unit material removal rate per unit width
Grahic Jump Location
Specific grinding energy versus maximum undeformed chip thickness
Grahic Jump Location
Surface roughness versus dimensionless active grain density

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In