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RESEARCH PAPERS

Thermomechanical Analytical 3D Thermal/Stress Estimation Sidewall Grinding Model

[+] Author and Article Information
Ya Yun Li, Jongwon Kim, Yunquan Sun, Yanhua Yang

Precision Manufacturing Center, The University of Connecticut, Storrs, CT 06269-5119

J. Manuf. Sci. Eng 121(3), 378-384 (Aug 01, 1999) (7 pages) doi:10.1115/1.2832692 History: Received May 01, 1995; Revised October 01, 1997; Online January 17, 2008

Abstract

A general three-dimensional thermal/stress grinding model, based on thermal and elastic/plastic classical analytical solutions, has been developed in this paper. The thermal model can predict the temperature distribution of surface and cylindrical external/internal creep-feed or conventional grinding for vertical or inclined sidewall surface grinding. This paper deals with a grinding burn problem that is widespread in the aerospace and automotive industries. The thermal model is compared with sidewall surface grinding experiments. The comparison of the temperature distribution results is expected. The general stress model has been developed, which combines both spherical and cylindrical coordinates. In addition, the 3D thermal/stress model is compared with four cases of external cylindrical grinding experiments. The residual stresses agree reasonably.

Copyright © 1999 by The American Society of Mechanical Engineers
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