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RESEARCH PAPERS

Mechanical Study for the Cutting and Clinching Process of Electronic Component Leads

[+] Author and Article Information
P. A. Engel, Kee Rong Wu, Xuejun Zhai

State University of New York at Binghamton, Binghamton, NY 13902

Stan Janisiewicz

Universal Instruments Co., Binghamton, NY 13905

J. Manuf. Sci. Eng 120(2), 279-286 (May 01, 1998) (8 pages) doi:10.1115/1.2830125 History: Received May 01, 1995; Revised December 01, 1995; Online January 17, 2008

Abstract

As various small electronics components are being rapidly moved along an assembly line, their leads must be cut and clinched into holes of a circuit board for the next soldering operation. This process must be achieved economically both in time, and in combating wear by preserving the cutting tools’ sharpness. The present study investigates the shearing action and subsequent fracture in cutting. Plastic analysis for both cutting and forming (clinching) is presented with the support of measured data obtained on a prototype machine employed in the research. Wear analysis of the cutting surfaces leads to a recognition of the role played by various geometric parameters such as lead shape, cutter and anvil angles, cutter and anvil distance, etc.

Copyright © 1998 by The American Society of Mechanical Engineers
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